What is dual inline pin package?

What is dual inline pin package?

In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket.

What is the purpose of a DIL socket?

DIL sockets (dual in-line sockets) are integrated circuit components used in almost all modern electronic devices. They have two parallel rows of pins set in a rectangular housing. The sockets have different numbers of pins to match the target integrated circuit.

What is inline package?

inline-package. Functions to Inline C, C++, Fortran Function Calls from R. Description. Functionality to dynamically define R functions and S4 methods with ‘inlined’ C, C++ or Fortran code supporting the .

What is IC socket?

An IC socket can be defined as an electromechanical device, which provides a removable interface between the IC package and the system circuit board with minimal effect on signal integrity. This allows the IC to function as it is soldered into the PCB, but it can be replaced by another IC or multiple ICs.

What does a dual inline package do?

Dual Inline Package. The dual inline package (DIP) was designed primarily to overcome the difficulties associated with handling and inserting packages into mounting boards. DIPs are easily inserted by hand or machine and require no spreaders, spacers, insulators, or lead-forming tools.

What is LCC package?

A leadless chip carrier (LCC or LLCC) is an integrated circuit package that has no pins/leads for contact. Leadless chip carriers are popular, as they are light in weight, adaptable to a wide range of applications and are considered ideal for surface-mount applications.

What is the advantage of hybrid integrated circuit?

The advantage of hybrid circuits is that components which cannot be included in a monolithic IC can be used, e.g., capacitors of large value, wound components, crystals, inductors.

What is difference between DIP and PDIP?

DIP (Dual Inline Package) is an integrated circuit package with two rows of pins. PDIP (Plastic Dual Inline Package) is a DIP package with a molded plastic body.

What do you mean by inline function in C++?

Inline function is a function that is expanded in line when it is called. When the inline function is called whole code of the inline function gets inserted or substituted at the point of inline function call. This substitution is performed by the C++ compiler at compile time.

What is BGA socket?

BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.

What is plastic dual in line package?

The Plastic Dual In-line Package, or PDIP, is one of the most mature plastic IC packages still in use today. It is rectangular in shape and has leads extending from both sides along its length, thus forming two sets of in-line pins. The PDIP comes in two body widths, i.e., 300 mils and 600 mils.

What is a dual in line pin package?

In microelectronics, a dual in-line package ( DIP or DIL ), or dual in-line pin package ( DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket.

What is a dual in line package in microelectronics?

“In microelectronics, a dual in-line package is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket.”

Which is the dual inline memory module socket?

Our portfolio features a broad range of socket solutions, including our LGA 3647 Socket family. TE offers a pin grid array (PGA) socket for your complex printed circuit. A dual inline memory module (DIMM) socket is made of a series of dynamic, random-access memory integrated circuits.

Who was the inventor of the Dual Inline Package?

The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent’s rule );